Moore’s Law for Flexible Integrated Circuits
Florian de Roose1, Hikmet Çeliker1,2, Wim Dehaene1,2 and Kris Myny1
1imec, Leuven, Belgium
2KU Leuven, Leuven, Belgium
Thin-film transistors (TFTs) are currently the dominant technology implemented as switching circuits in flat-panel displays and are promising candidates for Internet of Things (IoT) applications in near future. TFTs can be realized at low process temperatures, enabling direct manufacturing on ultrathin, flexible and large area substrates paving the way for seamless integration in everyday items. As the know-how on this flexible TFT technology increases (both in technology and design), more complex and denser structures are recently demonstrated for several Application-Specific Integrated Circuits (ASIC) with flexible TFTs. Thereby, thin-film transistor technologies follow a similar trend of increasing circuit complexity compared to conventional silicon CMOS technology.
In this tutorial talk, we will start by introducing three main TFT technologies currently available in several display and/or flexible circuit fabs: p-type organic TFTs, n-type metal-oxide TFTs and complementary low-temperature poly-silicon TFTs. We will dive into the advantages and disadvantages of each individual technology targeting flexible circuit applications and discuss their specific design challenges. The focus to solve these design challenges is the implementation of robust and fast switching logic gates at low power consumption. Finally, we will present two specific design cases towards large-scale integrated flexible circuits, namely a flexible 8-bit microprocessor and an ISO14443-A compliant NFC barcode tag [1]. Although these technologies today exhibit micrometer-size channel lengths, we will evaluate the impact of scaling for such flexible transistor technologies (similar as Moore’s law for Si CMOS) to enable future IoT applications.
Acknowledgements:
This work has received funding from the European Research Council (ERC) under
the European Union's Horizon 2020 research and innovation program under grant
agreement No 716426 (FLICs project).
[1] K. Myny, “The development of flexible integrated circuits based on thin-film transistors”, Nature Electronics 1, 2018.