IEEE SENSORS 2007 - October 28-31, 2007 - Atlanta, Georgia, USA
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Overview
Organization

Previous Conferences


Organization
Chairman
Boris Mizaikoff, Ph.D. - Georgia Institute of Technology, USA

Vice Co-Chairs
Suk-Han Lee Ph.D - Sungkyunkwan University, SOUTH KOREA
Pietro Siciliano, Ph.D. - Italian Nat'l Research Council, ITALY

Technical Program Chair
Paddy J. French, Ph.D. - Delft University of Technology, THE NETHERLANDS

Regional Technical Program Co-Chairs
Americas
Chang Liu Ph.D. - University of Illinois at Urbana-Champaign, USA

Europe/Africa
Andreas Hierlemann, Ph.D. - Eidgenössische Technische Hochschule Zürich (ETH Zürich), SWITZERLAND

Asia/Oceania
Sang Sik Yang, Ph.D. - Ajou University, SOUTH KOREA

Tutorial Chair
Peter J. Hesketh, Ph.D. - Georgia Institute of Technology, USA

Special Sessions Chair
Ruby N. Ghosh, Ph.D. - Michigan State University, USA

Local Organizing Co-Chairs
William D. Hunt, Ph.D. - Georgia Institute of Technology, USA
Nan M. Jokerst, Ph.D. - Duke University, USA

Treasurer
Chris Schober - Honeywell, USA

Publicity
John Vig - Consultant, USA

Abstract Coordination
Alliance Management Group LLC/ePapers.org, USA

Conference Management
Preferred Meeting Management, Inc., USA

Technical Program Committee
Narayan AluruUniversity of Illinois, USA
Helene AnderssonKTH - The Royal Institute of Technology, SWEDEN
David ArnoldUniversity of Florida, USA
Francisco J. ArreguiPublic University of Navarre, SPAIN
Massood AtashbarWestern Michigan University, USA
Nicolae BarsanUniversity of Tuebingen, GERMANY
Istvan BarsonyHungarian Academy of Sciences, HUNGARY
Andre BosscheDelft University of Technology, THE NETHERLANDS
Danick BriandUniversity of Neucatel, SWITZERLAND
Richard CernosekSandia National Labs, USA
Pei-Zen ChangNational Taiwan University, TAIWAN
Kukjin ChunSeoul National University, KOREA
Marina ColeUniversity of Warwick, UK
Elisabetta CominiUniversity of Brescia, ITALY
Frederik CreemerDelft University of Technology, THE NETHERLANDS
Brian CunninghamUniversity of Illinois, USA
Utkan DemirciHarvard-MIT Division of HST, USA
Bernard DiemCEA, FRANCE
Xiaoyi DingContinental Automotives, USA
Jonathan EngelHoneywell, USA
Masayoshi EsashiTohoku University, JAPAN
Gary FedderCarnegie Mellon University, USA
Jeff FrolikUniversity of Vermont, USA
Robert GaoUniversity of Massachusetts, USA
Anne-Marie GuéLAAS, FRANCE
Ricardo Gutierrez OsunaTexas A&M University, USA
Peter HauptmannUniversity of Magdeburg, GERMANY
Eiji HigurashiUniversity of Tokyo, JAPAN
Qing HuMassachusetts Institute of Technology, USA
Qing-An HuangSoutheast University, CHINA
Stanley H. HuangIndustrial Technology Research Institute, TAIWAN
Hak-In HwangKorea Electronics Technology Institute, KOREA
Bernhard JakobyUniversity of Linz, AUSTRIA
Hongrui JiangUniversity of Wisconsin, USA
Xiaoning JiangTRS Technologies, USA
Hyo-il JungYonsei University, KOREA
Subramanian KanakasabapathiGE Global Research, USA
Shin-Won KangKyungpook National University, KOREA
Butrus Khuri-YakubStanford University, USA
Chang-soo KimUniversity of Missouri , USA
Ki-hyung KimAjou University, KOREA
Taesong KimKorea Institute of Science and Technology, KOREA
Youn Tae KimElectronics and Telecommunications Research Institute, KOREA
Satoshi KonishiRitsumeikan University, JAPAN
Sander KosterUniversity of Groningen, THE NETHERLANDS
Martin KraftCTR - Carinthian Tech Research, AUSTRIA
Chee Yee KwokThe University of New South Wales, AUSTRALIA
Walter LangUniversity of Bremen, GERMANY
Dong-Weon LeeChonnam National University, KOREA
Jeong-Bong LeeUniversity of Texas Dallas, USA
Jong-Hyun LeeGwangju Institute of Science and Technology, KOREA
Sukhan LeeSungkyunkwan University, KOREA
Reinhard LerchUniversity of Erlangen, GERMANY
Wen J. LiChinese University of Hong Kong, CHINA
Xiaochun LiUniversity of Wisconsin, USA
Xinxin LiShanghai Institute of Metallurgy, CHINA
Qiao LinColumbia University, USA
Yu-Cheng LinNational Cheng Kung University, TAIWAN
Chang LiuUniversity of Illinois, USA
Anita Lloyd SpetzUniversity of Linkoping, SWEDEN
Ralf LucklumUniversity of Magdeburg, GERMANY
Mary Ann MaherSoftMEMS, USA
Kofi MakinwaDelft University of Technology, THE NETHERLANDS
Piero MalcovatiUniversity Pavia, ITALY
Santiago MarcoUniversity of Barcelona, SPAIN
Eickhoff MartinTechnical University Munich, GERMANY
Yoshinori MatsumotoKeio University, JAPAN
Ellis MengUniversity of Southern California, USA
Namki MinKorea University, KOREA
Phan Ngoc MinhInstitute of Material Science, ViETNAM
Yuji MiyaharaNational Institute of Material Science, JAPAN
Wilfried MokwaRWTH Aachen University, GERMANY
Brian MorganArmy Research Laboratory, USA
Subhas C. MukhopadhyayInstitute of Information Sciences and Technology, NEW ZEALAND
Rajesh NaikAir Force Research Laboratory Wright-Patterson, USA
Takamichi NakamotoTokyo Institute of Technology, JAPAN
Ramaier NarayanaswamyUniversity of Manchester, UK
Jae Y. ParkKwangwoon University, KOREA
Oliver PaulUniversity of Freiburg - IMTEK, GERMANY
Krishna PersaudUniversity of Manchester, UK
Christophe PijolatEMSE, FRANCE
Jaques PistreUniversity of Bordeaux, FRANCE
Gary PickrellVirginia Tech, USA
Konandur RajannaIndian Institute of Science, INDIA
Philippe RenaudEcole Polytechnique Federale de Lausanne, SWITZERLAND
Antonio RiccoStanford University, USA
Pavel RipkaCzech Technical University, CZECH REPUBLIC
Patrick RutherUniversity of Freiburg - IMTEK, GERMANY
Kee RyuIntel Corporation, USA
Scott SandersUniversity of Michigan, USA
Arjun SelvakumarColibrys, USA
Ashutosh ShastryUniversity of Washington, USA
Elfriede SimonSiemens, GERMANY
Sameer SonkusaleTufts University, USA
Goeran StemmeKTH - The Royal Institute of Technology, SWEDEN
Ming SuUniversity of Central Florida, USA
Yu SunUniversity of Toronto, CANADA
Hiroaki SuzukiUniversity of Tsukuba, JAPAN
Jacek SzuberSilesian Polytechnic University, POLAND
Marco TartagniUniversity of Bologna, ITALY
Svetlana Tatic-LucicLehigh Univerisity, USA
Francis TayNational University of Singapore, SINGAPORE
Thomas ThundatOak Ridge National Lab, USA
Vladimir TsukrukGeorgia Institute of Technology, USA
Kazuhiko TsutsumiMitsubishi Electric, JAPAN
Adisorn TuantranontNational Electronics and Computer Technology Center, THAILAND
Toshitsugu UedaWaseda University, JAPAN
Albert van den BergUniversity of Twente, THE NETHERLANDS
Chris Van HoofCatholic University Leuven, BELGIUM
Michiel VellekoopVienna University of Technology, AUSTRIA
Gerhard WachutkaTechnical University Munich, GERMANY
Lipeng WangIntel, USA
Sheng WangLockheed Martin, USA
Xuefeng WangGE Global Research, USA
Yuelin WangShanghai Institute of Metallurgy, CHINA
James WiczerSensor Synergy, USA
Wojciech WlodarskiRMIT University, AUSTRALIA
Yong XuWayne State University, USA
EH YangStevens Institute, USA
Sang Sik YangAjou University, KOREA
Xiongying YeTsinghua University, CHINA
John YeowUniversity of Toronto, CANADA
Jun ZouTexas A&M University, USA
Aniz ZribiGE Global Research, USA


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