Narayan Aluru | University of Illinois, USA |
Helene Andersson | KTH - The Royal Institute of Technology, SWEDEN |
David Arnold | University of Florida, USA |
Francisco J. Arregui | Public University of Navarre, SPAIN |
Massood Atashbar | Western Michigan University, USA |
Nicolae Barsan | University of Tuebingen, GERMANY |
Istvan Barsony | Hungarian Academy of Sciences, HUNGARY |
Andre Bossche | Delft University of Technology, THE NETHERLANDS |
Danick Briand | University of Neucatel, SWITZERLAND |
Richard Cernosek | Sandia National Labs, USA |
Pei-Zen Chang | National Taiwan University, TAIWAN |
Kukjin Chun | Seoul National University, KOREA |
Marina Cole | University of Warwick, UK |
Elisabetta Comini | University of Brescia, ITALY |
Frederik Creemer | Delft University of Technology, THE NETHERLANDS |
Brian Cunningham | University of Illinois, USA |
Utkan Demirci | Harvard-MIT Division of HST, USA |
Bernard Diem | CEA, FRANCE |
Xiaoyi Ding | Continental Automotives, USA |
Jonathan Engel | Honeywell, USA |
Masayoshi Esashi | Tohoku University, JAPAN |
Gary Fedder | Carnegie Mellon University, USA |
Jeff Frolik | University of Vermont, USA |
Robert Gao | University of Massachusetts, USA |
Anne-Marie Gué | LAAS, FRANCE |
Ricardo Gutierrez Osuna | Texas A&M University, USA |
Peter Hauptmann | University of Magdeburg, GERMANY |
Eiji Higurashi | University of Tokyo, JAPAN |
Qing Hu | Massachusetts Institute of Technology, USA |
Qing-An Huang | Southeast University, CHINA |
Stanley H. Huang | Industrial Technology Research Institute, TAIWAN |
Hak-In Hwang | Korea Electronics Technology Institute, KOREA |
Bernhard Jakoby | University of Linz, AUSTRIA |
Hongrui Jiang | University of Wisconsin, USA |
Xiaoning Jiang | TRS Technologies, USA |
Hyo-il Jung | Yonsei University, KOREA |
Subramanian Kanakasabapathi | GE Global Research, USA |
Shin-Won Kang | Kyungpook National University, KOREA |
Butrus Khuri-Yakub | Stanford University, USA |
Chang-soo Kim | University of Missouri , USA |
Ki-hyung Kim | Ajou University, KOREA |
Taesong Kim | Korea Institute of Science and Technology, KOREA |
Youn Tae Kim | Electronics and Telecommunications Research Institute, KOREA |
Satoshi Konishi | Ritsumeikan University, JAPAN |
Sander Koster | University of Groningen, THE NETHERLANDS |
Martin Kraft | CTR - Carinthian Tech Research, AUSTRIA |
Chee Yee Kwok | The University of New South Wales, AUSTRALIA |
Walter Lang | University of Bremen, GERMANY |
Dong-Weon Lee | Chonnam National University, KOREA |
Jeong-Bong Lee | University of Texas Dallas, USA |
Jong-Hyun Lee | Gwangju Institute of Science and Technology, KOREA |
Sukhan Lee | Sungkyunkwan University, KOREA |
Reinhard Lerch | University of Erlangen, GERMANY |
Wen J. Li | Chinese University of Hong Kong, CHINA |
Xiaochun Li | University of Wisconsin, USA |
Xinxin Li | Shanghai Institute of Metallurgy, CHINA |
Qiao Lin | Columbia University, USA |
Yu-Cheng Lin | National Cheng Kung University, TAIWAN |
Chang Liu | University of Illinois, USA |
Anita Lloyd Spetz | University of Linkoping, SWEDEN |
Ralf Lucklum | University of Magdeburg, GERMANY |
Mary Ann Maher | SoftMEMS, USA |
Kofi Makinwa | Delft University of Technology, THE NETHERLANDS |
Piero Malcovati | University Pavia, ITALY |
Santiago Marco | University of Barcelona, SPAIN |
Eickhoff Martin | Technical University Munich, GERMANY |
Yoshinori Matsumoto | Keio University, JAPAN |
Ellis Meng | University of Southern California, USA |
Namki Min | Korea University, KOREA |
Phan Ngoc Minh | Institute of Material Science, ViETNAM |
Yuji Miyahara | National Institute of Material Science, JAPAN |
Wilfried Mokwa | RWTH Aachen University, GERMANY |
Brian Morgan | Army Research Laboratory, USA |
Subhas C. Mukhopadhyay | Institute of Information Sciences and Technology, NEW ZEALAND |
Rajesh Naik | Air Force Research Laboratory Wright-Patterson, USA |
Takamichi Nakamoto | Tokyo Institute of Technology, JAPAN |
Ramaier Narayanaswamy | University of Manchester, UK |
Jae Y. Park | Kwangwoon University, KOREA |
Oliver Paul | University of Freiburg - IMTEK, GERMANY |
Krishna Persaud | University of Manchester, UK |
Christophe Pijolat | EMSE, FRANCE |
Jaques Pistre | University of Bordeaux, FRANCE |
Gary Pickrell | Virginia Tech, USA |
Konandur Rajanna | Indian Institute of Science, INDIA |
Philippe Renaud | Ecole Polytechnique Federale de Lausanne, SWITZERLAND |
Antonio Ricco | Stanford University, USA |
Pavel Ripka | Czech Technical University, CZECH REPUBLIC |
Patrick Ruther | University of Freiburg - IMTEK, GERMANY |
Kee Ryu | Intel Corporation, USA |
Scott Sanders | University of Michigan, USA |
Arjun Selvakumar | Colibrys, USA |
Ashutosh Shastry | University of Washington, USA |
Elfriede Simon | Siemens, GERMANY |
Sameer Sonkusale | Tufts University, USA |
Goeran Stemme | KTH - The Royal Institute of Technology, SWEDEN |
Ming Su | University of Central Florida, USA |
Yu Sun | University of Toronto, CANADA |
Hiroaki Suzuki | University of Tsukuba, JAPAN |
Jacek Szuber | Silesian Polytechnic University, POLAND |
Marco Tartagni | University of Bologna, ITALY |
Svetlana Tatic-Lucic | Lehigh Univerisity, USA |
Francis Tay | National University of Singapore, SINGAPORE |
Thomas Thundat | Oak Ridge National Lab, USA |
Vladimir Tsukruk | Georgia Institute of Technology, USA |
Kazuhiko Tsutsumi | Mitsubishi Electric, JAPAN |
Adisorn Tuantranont | National Electronics and Computer Technology Center, THAILAND |
Toshitsugu Ueda | Waseda University, JAPAN |
Albert van den Berg | University of Twente, THE NETHERLANDS |
Chris Van Hoof | Catholic University Leuven, BELGIUM |
Michiel Vellekoop | Vienna University of Technology, AUSTRIA |
Gerhard Wachutka | Technical University Munich, GERMANY |
Lipeng Wang | Intel, USA |
Sheng Wang | Lockheed Martin, USA |
Xuefeng Wang | GE Global Research, USA |
Yuelin Wang | Shanghai Institute of Metallurgy, CHINA |
James Wiczer | Sensor Synergy, USA |
Wojciech Wlodarski | RMIT University, AUSTRALIA |
Yong Xu | Wayne State University, USA |
EH Yang | Stevens Institute, USA |
Sang Sik Yang | Ajou University, KOREA |
Xiongying Ye | Tsinghua University, CHINA |
John Yeow | University of Toronto, CANADA |
Jun Zou | Texas A&M University, USA |
Aniz Zribi | GE Global Research, USA |